Samsung Launches Industry’s First UFS 4.0 Multi-Chip Package for Next-Gen Mobile Devices. Seoul, South Korea – Samsung Electronics announced the release of the industry’s first Universal Flash Storage (UFS) 4.0 Multi-Chip Package (MCP). The new storage solution targets high-performance applications in 5G/6G smartphones, wearables, and augmented reality (AR) devices. It aims to deliver faster data speeds, higher capacity, and improved power efficiency compared to previous generations. The UFS 4.0 MCP combines Samsung’s latest 7th-generation V-NAND with a dedicated controller. It supports data transfer speeds of up to 4.2 gigabytes per second per lane. This doubles the performance of UFS 3.1. The package integrates both NAND flash memory and a controller in a single chip. It also includes low-power double data rate 5X (LPDDR5X) DRAM to enhance processing capabilities. Samsung claims the design reduces power consumption by up to 25% compared to earlier models. The upgrade addresses growing demand for advanced storage in AI-powered mobile devices and high-resolution media applications. “This breakthrough reflects our commitment to pushing the limits of memory technology,†said a Samsung spokesperson. The UFS 4.0 MCP offers storage options up to 1 terabyte. It is optimized for devices requiring fast read/write operations and sustained performance. Samsung expects the solution to be widely adopted in premium smartphones, extended reality (XR) hardware, and automotive systems. Mass production is scheduled to begin in the second half of 2024. The company plans to expand its UFS 4.0 lineup to support emerging applications in AI and machine learning. Samsung remains a key player in the global memory market, with its latest innovation reinforcing its leadership in high-speed storage solutions.
(Samsung Releases The Industry’S First Ufs 4.0 Multi-Chip Package)
